| 摘要 |
PURPOSE:To increase cooling effect of a wafer, by attaching a membrane material, over which a heat-conductive elastic material in pasted, on a rotary disk, curving it in a convex form by a water pressure, and contacting closely to the wafer over the membrane material. CONSTITUTION:A wafer 11 is placed on a wafer press up shaft 20, an up and down head 24 is lowered to pull down a holder 14, and the periphery of the wafer 11 is squeezed by a wafer press down member 16. On a rotary disk 1 is fixed a membrane material 9, over which a heat-conductive elastic material 10 is pasted, being contacted closely to the rear surface of the wafer 11. The membrane material 9 is curved in a convex from and imposes a pressure to the rear surface of the wafer 11, by the water pressure of the cooling water 5 and by a centrifugal force of the rotation of the wafer 11. In this system, the heat of high temperature ion beams 18 is transmitted efficiently through the cooling water 5. In this case, the distance from the rear surface of the wafer 11 to the cooling water 5 is shortened to get a good heat-conductive effect, and the curve of the membrane material 9 is converted readily by the water pressure, to respond to the difference size and the thickness of the wafer 11.
|
