| 摘要 |
PURPOSE:To homogenize a soldering and to increase productivity by scanning at high speed a laser beam via optical system and by performing soldering with melting solders on plural joining parts. CONSTITUTION:A laser beam 2 is subjected to a spot irradiation on the contact 7' of the electronic component 6 of the above of a printed circuit board 5 with being converged by a curve mirrors 3 and 4. The curve mirrors 3 and 4 are made light-weighed, vibrating at the high speed of several scores Hz approx. and irradiating the laser beam 2 in numerous times in short time on plural soldering contacts 7'. With this method the part to be joined is heated nearly simultaneously and uniformly because of the laser beam being scanned at high speed on the plural parts to be joined. The problem of solder floating by individual joint method and defective contact, defective continuity, etc. are therefore prevented. The soldering is made uniform and made quickened, so the productivity is increased. |
