发明名称 WAFER HANDLING METHOD
摘要 PURPOSE:To perform supply and recovery of wafers by the same cassette, by transferring all the wafers stored in the cassette to a stocker so as to empty the cassette, conveying the wafers from the stocker for treatment, and recovering the treated wafers into the original cassette. CONSTITUTION:A cassette 22A, in which wafers 2 that are not injected are accommodated, is mounted on the uppermost position. The wafer 2 is taken out of the lower stage side of the cassette 22A one by one and inputted into the lower side immediately beneath a dummy wafer 2d in a stocker 26A in sequence. All the wafer 2 in the cassette 22A are transferred to the stocker 26A. Then, the wafers 2 are sequentially supplied to a disk 4 from the lowest stage of the stocker 26A. After ion implantation, the wafer 2 is taken out of a position P1 of the disk 4 and recovered to the uppermost stage (i.e., original position) of the original cassette 22A through a space part S in the stocker 26A. The next wafer 2 in the stocker 26A is mounted on the position P1 of the disk 4, and the second ion implantation is performed.
申请公布号 JPS61168934(A) 申请公布日期 1986.07.30
申请号 JP19850010616 申请日期 1985.01.22
申请人 NISSIN ELECTRIC CO LTD 发明人 NOGAMI TSUKASA
分类号 B65G47/80;H01J37/317;H01L21/265;H01L21/67;H01L21/677 主分类号 B65G47/80
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