发明名称 |
Semiconductor laser structure including dual mounts having ridge and groove engagement |
摘要 |
A mounting of semiconductor laser chip on a heat sink or metal mount is improved so as to enable high accuracy of position and direction. A heat sink or metal mount, on which a semiconductor laser chip is mounted, comprises two parts, namely a main mount or larger portion and a sub-mount or smaller portion. The semiconductor laser chip is soldered by a solder layer on the sub-mount utilizing a microscope so as to assure an accurate position and an accurate direction with respect to the sub-mount. Then, the sub-mount is soldered on the main mount by a solder layer with an accurate relation both in position and direction by engaging a linear ridge as a first engaging means provided on the upper face of the main mount with a straight groove and a rear end face as a second engaging means. As a result of the above-mentioned structure, accurate position and direction of the semiconductor laser chip with respect to the mount is easily obtainable with a high yield.
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申请公布号 |
US4603419(A) |
申请公布日期 |
1986.07.29 |
申请号 |
US19850768144 |
申请日期 |
1985.08.22 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SHIMIZU, HIROKAZU;ITOH, KUNIO;SUGINO, TAKASHI;WADA, MASARU |
分类号 |
H01S5/00;H01L21/60;H01S5/02;(IPC1-7):H01S3/045 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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