| 摘要 |
PURPOSE:To reduce the area of a bonding element and thereby to make the apparatus small in size by a construction wherein a mechanism for holding a metal slender wire is provided additionally in the vicinity of the fore end of a capillary. CONSTITUTION:When bonding is executed in a wire-bonding apparatus, first holding rods 7 are moved forward, a capillary 3 is moved above a bonding portion 60 on a pellet 6 in the condition that a metal wire 2 is held between by the rods, and the fore end of the metal wire 2 is made to contact with the bonding portion 60 to be bonded thereto. Then, the holding rods 7 are moved backward, the capillary 3 is moved above another bonding portion 61 in the condition that the metal wire 2 can be drawn out, and ultrasonic bonding is executed in the same way as the above. Thereafter the holding rods 7 are moved forward, the capillary 3 is shifted in the lateral direction in the condition that the metal wire is held between by the rods, so that the metal wire 2 be cut off mechanically, and thereby the process is completed. |
