| 摘要 |
PURPOSE:To join a new semiconductor chip to a mounting substrate properly, by leaving protuberant electrodes in a prescribed amount or little respectively on the mounting substrate side when a preceding semiconductor chip is removed from the mounting substrate, and by utilizing a plane left behind. CONSTITUTION:A semiconductor device is mounted on a mounting stage 4 with the mounting substrate 3 thereof down, and position-adjustment is conducted so that the part of a semiconductor chip 1 comes to the central part of the mounting stage 4. Next, the semiconductor chip 1 is sucked and held by a vacuum holding jig 6 and is heated from the mounting substrate 3 side by infrared rays 5 while subjected to minute vibrations in the horizontal direction by a vibrator. When the material of protuberant electrodes 2 begins melting, the chip is exfoliated from the mounting substrate 3. On the occasion, the vacuum holding jig 6 is moved upward to separate the semiconductor chip from the substrate. According to this method, the material of the protuberant electrodes 2, such as a solder bump, is scarcely left behind in a part wherefrom the semiconductor chip 1 is removed. Therefore a mounting plane is made flat, and thus a new good semiconductor chip can be joined thereon properly. |
