| 摘要 |
PURPOSE:To improve the precision in positioning semiconductor elements by a method wherein the movement of the semiconductor elements caused when they are heated by a reflow lamp is restrained by a photoresist frame. CONSTITUTION:A photoresist is applied 20-30mum thick on a substrate 1 on the surface of which an electrode pattern 2 is formed of Au or the like, and is subjected to prebaking in a thermostatic chamber. Next, exposure by using a glass mask, development and postbaking are applied to the photoresist, and thereby a photoresist frame 3 is formed. The frame 3 is formed in the number of elements of an LED array, on a straight line, so that the adjacent sides of frames are common to each other. Then, a metal mask being used, solder cream 4 is printed inside each photoresist frame 3. Thereafter each element 5 of the LED array is placed in juxtaposition inside the photoresist frame 3 by a picker and heated by a reflow lamp. Then the solder cream 4 is melted and each element 5 of the LED array is joined by solder to the electrode pattern 2. |
