发明名称 |
Desoldering apparatus and method |
摘要 |
Apparatus for the selective removal of the solder and a connector soldered in the through hole of a circuit panel including means for heating the solder and a pair of aligned tubes placed against opposite surfaces of the panel surrounding the connecting through hole with the tubes being supplied with fluid under pressure so as to produce a pressure differential across the solder column in the through hole and effective to urge the connector and solder from the through hole into the low pressure tube when the solder is melted.
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申请公布号 |
US4602733(A) |
申请公布日期 |
1986.07.29 |
申请号 |
US19850690389 |
申请日期 |
1985.01.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SLACK, JOHN R.;VON VOSS, WILLIAM D. |
分类号 |
B23K1/018;(IPC1-7):B23K3/04;H05K13/04 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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