发明名称 SEMICONDUCTOR ELEMENT
摘要 A sealing compsn. consists of epoxy resin 15-20 wt.%, inorg. fillers 68-72 wt.%, hardener 5-25 wt.%, pref. 15-20 wt.%, hardening accelerator 0.2-0.8 wt.%, and polar compd. 0.3-0.7 wt.%. The said epoxy resin, such as bisphenol-type epoxy, has an equiv. of 200 230 and a softening temp. of below 90≦̸C. The inorg. filler is pref. fused silica powder, which has few impurities, fine particle size and low thermal expansion coeff. The hardener is pref. phenol resin with a phenol equiv. of below 200. The polar compd. such as triethylene glycol is used for increasing fluidity. The sealant shows no problem after it is steamed with 2 atm. pressures for 800 hrs.
申请公布号 KR860001040(B1) 申请公布日期 1986.07.28
申请号 KR19840005454 申请日期 1984.09.06
申请人 LEE BU-SOP 发明人 LEE BU-SOP
分类号 H01L23/08;(IPC1-7):H01L23/08 主分类号 H01L23/08
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