发明名称 TARGET FOR SPUTTERING
摘要 PURPOSE:To increase the size of a target material and to improve eventually productivity by dividing the flat plate-shaped target material to plural divided bodies and forming the mating surfaces thereof so as to include the surfaces oblique or orthogonal with at least the thickness direction of the target material. CONSTITUTION:The flat plate-shaped and rectangular target material 32 is divided longitudinally to, for example, three divided bodies 37 in the stage of constituting a target 30 by soldering the target material 32 atop a backing plate (BP)31 in use as a cathode. The mating surfaces 38 of the respective divided bodies 37 are formed in such a manner that the shape of the section orthogonal with the surfaces 38 is made into a crank shape or is inclined with the thickness direction of the target material 32. The BP31 consists of a copper metal and is preferably formed with an Ni plating layer on the surface. The target material 32 consists preferably of a Co-Cr alloy.
申请公布号 JPS61166964(A) 申请公布日期 1986.07.28
申请号 JP19850007061 申请日期 1985.01.18
申请人 TOKUDA SEISAKUSHO LTD 发明人 SHIODA TOMOSHIRO;SATOYAMA SHOZO;TANAKA KATSUYUKI;TAMURA EIZO
分类号 C23C14/36;C23C14/34 主分类号 C23C14/36
代理机构 代理人
主权项
地址