发明名称 METHOD AND DEVICE FOR SUPPLYING LOCALLY PROCESSING FLUID
摘要 PURPOSE:To process effectively only the specific very small processing part while suppressing the influence to the other part as best as possible in the stage of plating or etching the very small part of a work by using a specifically constructed processing fluid injection device and laser light. CONSTITUTION:The device made into the three-layered construction consisting of an outside cylinder 1, an inside cylinder 2 and an inside cylinder 3 from the outside is used for the device for supplying the processing fluid such as plating or etching soln. in order to plate or etch the specific very small part 9 on the surface of the work 8. The central axis of the inside cylinder 3 is disposed right above the part 9 to be processed at a slight spacing therefrom and the processing fluid is supplied from the inside cylinder 3 through an introducing pipe 7; at the same time, the processing fluid and the part 9 is activated by the laser light 11 by which the part 9 is subjected to processing such as plating. The processing fluid enters the cylinder 2 from the bottom end of the cylinder 3 and is discharged therefrom through a discharge pipe 6. Fluid such as air is supplied through an introducing pipe 5 into the cylinder 1 to prevent contact of the processing fluid with the other part except the part 9 by the pressure thereof. Only the part 9 is thus exactly processed.
申请公布号 JPS61166989(A) 申请公布日期 1986.07.28
申请号 JP19850007542 申请日期 1985.01.21
申请人 HITACHI LTD;HITACHI TECHNO ENG CO LTD 发明人 OGINO HIROYUKI;WAI SHINICHI;SASAKI HIDEAKI;IMURA MIDORI;HIRAYAMA KAORU;FUJINAMI HIROSHI
分类号 C23F4/04 主分类号 C23F4/04
代理机构 代理人
主权项
地址