发明名称 ETCHING METHOD OF INSULATION FILM
摘要 PURPOSE:To enable a wiring without disconnection by making the side surface of the aperture in an etching region inclined wet-etching a lamination of plural phosphorus silicate glasses of different phosphine concentration with buffer hydrofluoric acid. CONSTITUTION:The side surface of the aperture in an etching region is made inclined by wet-etching with buffer hydrofluoric acid a lamination of plural phosphorus silicate glasses of different phosphine concentration. That is, the first layer 12 is wet-etched with buffer hydrofluoric acid from the part corresponding to the aperture of a resist film 14 and a gap 15 and the first layer 12 is etched from the upper surface and the side surface whereby a contact hole 16 the section of which is made inclined is formed.
申请公布号 JPS61166031(A) 申请公布日期 1986.07.26
申请号 JP19840275350 申请日期 1984.12.25
申请人 FUJITSU LTD 发明人 KURIO ISAMU;YAMASHITA EIICHI;TAKAHASHI KOJI;SUZUKI SHUICHI
分类号 H01L21/306;H01L21/302;(IPC1-7):H01L21/302 主分类号 H01L21/306
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