发明名称 |
ETCHING METHOD OF INSULATION FILM |
摘要 |
PURPOSE:To enable a wiring without disconnection by making the side surface of the aperture in an etching region inclined wet-etching a lamination of plural phosphorus silicate glasses of different phosphine concentration with buffer hydrofluoric acid. CONSTITUTION:The side surface of the aperture in an etching region is made inclined by wet-etching with buffer hydrofluoric acid a lamination of plural phosphorus silicate glasses of different phosphine concentration. That is, the first layer 12 is wet-etched with buffer hydrofluoric acid from the part corresponding to the aperture of a resist film 14 and a gap 15 and the first layer 12 is etched from the upper surface and the side surface whereby a contact hole 16 the section of which is made inclined is formed. |
申请公布号 |
JPS61166031(A) |
申请公布日期 |
1986.07.26 |
申请号 |
JP19840275350 |
申请日期 |
1984.12.25 |
申请人 |
FUJITSU LTD |
发明人 |
KURIO ISAMU;YAMASHITA EIICHI;TAKAHASHI KOJI;SUZUKI SHUICHI |
分类号 |
H01L21/306;H01L21/302;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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