发明名称 PRINTING PLATE FOR CREAMY SOLDER
摘要 PURPOSE:To provide a printing plate suitable for applying a creamy solder to a rugged printed substrate by printing, by a method wherein a metallic plate is provided with a recessed part on one side thereof, and is etched on the opposite side thereof so as to leave a metallic part in the periphery of said recessed part to thereby provide a projected part. CONSTITUTION:The printing plate 8 is used for stably applying a creamy solder to a flexible substrate 1-1 in order to fix electronic parts 7 provided in a recessed part 6 of the printed substrate 1. The printing plate 8 is produced by a method wherein a metallic sheet 2 is provided with a recessed part 3 on one side thereof by etching, small holes 4 are provided in the recessed part 3, and the other side of the sheet 2 is etched so as to leave the metallic part in the periphery of said recessed part 3 to provide the projected part 5. In the condition wherein the projected part 5 is mated to the recessed part 6 of the printed substrate 1, the creamy solder is applied by printing, whereby the solder can be applied to the electronic parts 7 located in the recessed part 6.
申请公布号 JPS61164895(A) 申请公布日期 1986.07.25
申请号 JP19850006956 申请日期 1985.01.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORISHIMA NORIAKI
分类号 B23K1/20;B41C1/14;B41F15/36;B41N1/24;H05K3/12;H05K3/34 主分类号 B23K1/20
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