发明名称 PROCEDE PERMETTANT D'APPLIQUER DES SUREPAISSEURS AUX PLAGES DE CONTACT D'UN MICROCIRCUIT ELECTRONIQUE
摘要 A method of providing a raised contact portion on a contact area of an electronic microcircuit in which a ball is formed at one end of a metal wire by means of thermal energy, the ball is pressed against a contact area of the electronic microcircuit and is connected to said contact area. A weakening is created in the wire near the ball and the wire is then severed at the area of the weakening to provide the desired raised contact portion.
申请公布号 FR2502397(B1) 申请公布日期 1986.07.25
申请号 FR19820004519 申请日期 1982.03.17
申请人 PHILIPS GLOEILAMPENFABRIEKEN NV 发明人 HERMANUS ANTONIUS VAN DE PAS ET HUIBERT ARNOLDUS KNOBBOUT
分类号 H01H11/06;H01L21/28;H01L21/60;H01L21/603;H01L21/607;H01L23/485;H05K3/24;(IPC1-7):H01L21/28;H01L21/44 主分类号 H01H11/06
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