| 摘要 |
PURPOSE:To join an external lead precisely by arranging a position where a semiconductor device is cut from a carrier tape and a position where the semiconductor device is fitted to a printed board at approximately the same height and detecting and correcting each positional displacement between the both positions. CONSTITUTION:A transfer section 12 has an XY base 29, a Z base 31 and a theta base 30, and a theta'' base 30'' is attached at the nose of a fixing arm 28 for the theta base 30 and a sucker is mounted. A theta' base 30' is placed onto the theta base 30, and driven and turned relatively to the base 30. A wire 55 is stretched between the bases 30' and 30''. A camera 32 detects displacements in the X-Y and theta directions of a sucked 27 element 2 from a lower surface, and the camera is positioned on its midway of the course of the element carried by the arm 28 up to a joining base 22 from a cutting section 20. A camera 24 detects displacements in the X, Y and theta directions of leads for a printed substrate 3 on the joining base 22. The positional displacement signals of the element 2 and the printed board 3 are processed by a CPU, and the base is driven through an interface control system, and external leads for the element and the leads for the printed board 3 are aligned, thus correctly joining the external leads. |
