| 摘要 |
PURPOSE:To facilitate connecting work by separating the center of a die pad in the longitudinal direction from the center of a package by 0.7mm or more in the DIL type package with a lead at the center of the package. CONSTITUTION:The center (the center of a chip 5) C-C' of a die pad 2 for a lead frame 1 is separated from the center B-B' of a package by approximately 1.27mm, and two internal electrodes 7 connected to leads 4-5, 4-14 at the center of the package by wires 8 are arranged to the same end surface. According to the constitution, when the chip 5 is loaded onto the die pad 2 for the lead frame 1 and wired, the length of the wires 8 to the leads 4-5, 4-15 is shortened only by the quantity of displacement between the centers C-C' and B-B', the wires 8 are easy to be connected, and the wires 8 and the die pad 2 are not brought into contact, thus improving reliability. The quantity of displacement is selected at 0.7mm or more in consideration of the facilitation of connections. |
