| 摘要 |
PURPOSE:To eliminate generating a crack on a passivation film of a semiconduc tor element by a filler by a method wherein the filler contained to a resin constituent is subjected to possessing ferromagnetism and impression is perfomed to magnetic field so that the filler is gone away from the wiring surface of the semiconductor element at the time of resinous enclosing. CONSTITUTION:A resin constituent is injected at the state of turning upward the surface on which a passivation film 7 is provided. At this time, an epoxy resin 8 is in melting state and each piece of a filler 11 can be in motion within the epoxy resin 8. Magnetic field is impressed in the arrow 12 direction in case of injection of the above-stated resin constituent. The filler 11 applied by ferromagnetic body particles is drawn so as to go away from the passivation film 7 on a semiconductor element 1, additionally since the filler 11 is fixed being supported by resin stiffness after curing the epoxy resin 8, the filler 11 does not pierce of the surface of the passivation film 7. |
