| 摘要 |
A method and product are presented for tape automated bonding of integrated circuits wherein the tape comprises a thin layer of a polyimide adhesive film (34) sandwiched between a thicker layer of pre-punched polyimide (26) and conductive foil (32). Thereafter, the adhesive film may be imaged and etched to form an unsupported annular ring for supporting a plurality of beam leads which have been etched from the conductive foil. <IMAGE> |
