| 摘要 |
PURPOSE:To enable an automatic positioning and to enhance the working efficiency by identifying a positioning mark drawn on the probe plate by an identifying device and by correcting the shifting from the reference mark information. CONSTITUTION:In a probe device measuring semiconductor wafer chips, the probe plate 15 is adsorbed by the vacuum pressure of an adsorbing device to a ring insert 11 provided with a card 16. Then, the positioning mark 15C on the probe plate 15 is identified by an identifying device 4. Then identified information and reference position mark information are compared with each other, and if there is a shifting between the two, the difference thereof is calculated by arithmetic unit 2 and a ring insert 11 is rotated. If there is the shifting to X-Y direction, a transfer stand 7 which is adsorbing the wafer 7 is moved to coincide with the reference position mark information and the identified position information of 15C.
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