| 摘要 |
PURPOSE:To enable to mount a battery without increasing the area of a semiconductor element placing part by a method wherein the semiconductor element is fixed to one surface of an insulating plate, a data retaining battery is fixed and connected to the other surface, and they are housed in a package. CONSTITUTION:A semiconductor element 13 is mounted on both surfaces of the island part 11 of a lead frame, and a data retaining battery 14 is fixed. Inner leads 12 and 12', the semiconductor element 13 and the battery 14 ar connected using metal wirings 15 and 15' respectively. At this time, one of electrode is connected to the semiconductor element through the intermediaries of the lead frame and the metal wirings. The occupation area of the semiconductor element placing part can be reduced by half by performing the above- mentioned wiring. Moreover, as they are housed in the same package, it is unnecessary to increase the external measurements of the package itself. |
