发明名称 FLAME-RETARDANT EPOXY RESIN MOLDING COMPOSITION, AND ELECTRONIC PART ENCAPSULATED THEREWITH
摘要 PURPOSE:To produce the titled composition containing little bromine ion, etc. extractable under specific condition, having excellent reliability in hot and humid state, and suitable for the encapsulation of electronic part, by compounding a brominated compound and Sb trioxide as the flame-retardant agent to an epoxy resin composition. CONSTITUTION:The objective composition can be produced by compounding (A) 0.5-1.5wt% (in terms of bromine in the whole composition) brominated epoxy resin or a brominated phenolic compound, (B) 0.8wt% antimony trioxide, (C) 20-40wt% epoxy resin and (D) 60-80wt% inorganic filler (e.g. talc). When the composition is cured with a hardener (e.g. maleic anhydride) and extracted for >=100hr under pressure-cooker condition in the form of 100 mesh pass fine powder, the amount of chlorine ion and bromine ion extracted in water is <=10ppm.
申请公布号 JPS61162514(A) 申请公布日期 1986.07.23
申请号 JP19850000845 申请日期 1985.01.09
申请人 HITACHI LTD 发明人 OGATA MASAJI;ABE HIDETOSHI;SEGAWA MASANORI;NISHIKAWA AKIO
分类号 C08G59/00;C08G59/30;C08G59/32;C08K3/20;C08L63/00 主分类号 C08G59/00
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