| 摘要 |
<p>A deformable vacuum pin chuck includes a thin silicon chuck 17 for supporting a semiconductor wafer 1 during lithographic processing and a number of piezo-electric transducers 9 for selectively deforming the chuck. Chuck deformation caused by application of electric potentials to selected transducers may be used to correct flatness deviations in the wafer and, thereby, a desired degree of flatness of the semiconductor wafer may be obtained.</p> |
