| 摘要 |
<p>An acid gold electroplating bath contains gold in an electrodepositable form, such as potassium gold cyanide, together with a metallic additive and an organic additive. The organic additive is a compound of the formula <CHEM> wherein X is -N= or -CR<3>=, and R<1>, R<2> and R<3> are each hydrogen, or an amino-, amido, thioamido- or cyano- group provided that one (and no more than one) of R<1>, R<2> and R<3> is not hydrogen. The metallic additive is preferably a cobalt, nickel or iron salt.</p> |
