发明名称 BONDING AND TWO-STEP REACTION-TYPE ADHESIVE THEREFOR
摘要 PURPOSE:To accomplish bonding with high initial adhesive force enabling adhesion to be attained under non-press condition, suitable for base material with curved surface, applicable, as adherend, to metals, by coating specific adhesive on a base material followed by light irradiation and laminating adherend followed by curing. CONSTITUTION:A two-step reaction-type adhesive (pref. with a glass transition temperature after light irradiation <=ca.40 deg.C) comprising (A) a non- photopolymerizable epoxy resin or isocyanate compound, (B) a curing agent therefor and (C) a second compound having in one molecule at least one photopolymerizable vinyl group is coated on a base material followed by light irradiation on the coated surface throughout to develop tackiness, then laminating an adherend during exhibiting the tackiness followed by curing, thus accomplishing the objective bonding.
申请公布号 JPS61162574(A) 申请公布日期 1986.07.23
申请号 JP19850001800 申请日期 1985.01.08
申请人 TAKEDA CHEM IND LTD 发明人 KUBOTA TSUTOMU;NAKAI YOSHIKAZU
分类号 C08G59/00;C08G59/18;C08G59/40;C09J5/00;C09J175/00 主分类号 C08G59/00
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