| 摘要 |
A method for attaching semiconductor dies to metal package supports is characterised by the use of a homogeneous soft solder preform. The soft solder preform has a uniform microstructure which is free from contaminants, such as organic materials, as well as from intermetallics, and has a particule size below about 10 microns. Such homogeneous preforms provide a bonding layer between the semiconductor device and a metal support frame which is initially free from voids and which resists deformation and cracking during subsequent power cycling of the device. The reduction in voids and cracking, in turn, allows for uniform head dissipation in the device, eliminating hot spots and extending the life of the device. |
