| 摘要 |
<p>An adherent electrically conductive surface layer is electrolessly deposited on a non-conductive generally rigid substrate e.g. for EMI/RFI shielding by first applying to the surface a polymer lacquer layer of e.g. 2 to 20 microns thickness containing particles of metal such as Ni, Cu, Ag, Al, Fe, Co, Pd, Ti, Zn, Mg, An, Pt or alloys thereof (e.g. 0.2-10 microns), allowing it to convert to an adherent solid surface layer; if necessary treating this surface layer to ensure that the outermost surface particles serve as good electroless initiation sites; and subsequent electroless deposition e.g. of a Cu, Ni, Ni/P alloy, or Ni/B alloy layer of e.g. 0.5-10 microns thick which can itself by electrolytically or electrolessly overplated if desired. The polyester layer may be formed by applying a polymeric material dispersed in an organic solvent, although it may be applied as a polymerisable material. Numerous examples of suitable materials are provided.</p> |
