发明名称 COMPOSITION FOR ADHESIVE REMOVAL
摘要 <p>PURPOSE:To provide the titled composition of great dissolving power for adhesives thus enabling their removal to be accomplished in a short time, non- flammable, without need of wiping out, comprising low-boiling point halogenated hydrocarbon medium-boiling point halogenated hydrocarbon, polar solvent and silicon oil in specific proportion. CONSTITUTION:The objective composition comprising (A) 5-40wt% of a low- boiling point halogenated hydrocarbon (e.g., methylene chloride), (B) 45-90wt% of a medium-boiling point halogenated hydrocarbon (e.g., trichloroethane), (C) 1-10wt% of a polar solvent (e.g., ethylene glycol monoethyl ether) and (D) 0.1-5wt% of a silicon oil (e.g., methylphenyl silicone). USE:For removal of electric wire-covering materials for indoor wiring.</p>
申请公布号 JPS61162575(A) 申请公布日期 1986.07.23
申请号 JP19850002714 申请日期 1985.01.11
申请人 MASARU KOGYO KK;UIRUSON:KK 发明人 SHIINA YASUSHI;YAMAGUCHI MASAYUKI
分类号 C09J5/00;H02G1/06;H02G1/12 主分类号 C09J5/00
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