发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the dip in a wire, by providing a wire support table having pads in the intermediate portion between stitches and a pellet to be fixed at or near the center of the island. CONSTITUTION:Before mounting a pellet 5 at the center of an island 9 on a case 1, a wire support table 4 having a multiplicity of pads 8 arranged thereon is mounted in the intermediate portion between the pellet 5 to be mounted and stitches 2. A wire 3 is then bonded by a bonder to the stitches 2, to the wire support table 4 and to the pellet 5 in that order or to the pellet 5, to the wire support table 4 and to the stitches 2 in that order. Au-Si is used as a mounting material for mounting the wire support table 4 and the pellet 5. The wire support table 4 is formed of the same material and to have the same thickness with the pellet 5.
申请公布号 JPS61161730(A) 申请公布日期 1986.07.22
申请号 JP19850002732 申请日期 1985.01.11
申请人 NEC CORP 发明人 YOSHIDA HISAO
分类号 H01L21/60 主分类号 H01L21/60
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