DIFFUSION JOINING METHOD OF TITANIUM AND ALUMINUM

摘要

PURPOSE:To make possible the joining of high melting metallic Ti and low melting metallic Al and to obtain a good joint part at the temp. below the m.p. of Al forming a low melting alloy layer on the joint surface of Ti. CONSTITUTION:The alloy layer 3 which has the m.p. lower than the m.p. of Ti and is suitable for joining at the temp. lower than the m.p. of Al 1 is formed on the joint surface of the Ti 2 which is the high melting metal in joining of the Ti 2 which is the high melting metal and the Al 1 which is the low melting metal. The layer 3 is mated with the joint surface of the Al 1 and both joint surfaces are joined after heating to melt. The alloy contg. several % Cu or Ti in Al-Si is used for the low melting alloy layer to be provided to the joint surface of the high melting metal and the alloy layer is formed in an inert atmosphere by a sputtering vapor deposition method using said alloy as a target.