| 摘要 |
PURPOSE:To remove thin films and flashes without damaging the resin surface of the titled device, by a method wherein high-pressure water is sprayed to the resin and flashes. CONSTITUTION:Thin films 15 formed at the same time with semiconductor chip sealing are formed in the region of a lead frame 11 surrounded by a resin 14, leads 12, and tie bars 13. Flashes 16 infiltrating from the gap of a sealing die during the work of resin sealing are formed on the surfaces of the leads 12 and tie bars 13. High-pressure water 18 led from a high-pressure source to a nozzle 17 is sprayed to these thin films and flashes 16. The thin films 15 and flashes 16 are removed by moving the water 18 along the outer periphery of the resin 14. It is preferable to spray thin water 18 in spots to the main surface of the lead frame 11 from an almost vertical direction. This manner can remove thin films and flashes without damaging the resin. |
