发明名称 ROOM TEMPERATURE-CURABLE POLYORGANOSILOXANE COMPOSITION
摘要 PURPOSE:To make it possible to decrease the compression set in curing and to increase hardness, by forming a composition comprising a polyorganosiloxane, an alkoxysilane, a curing catalyst and polymethylsilsesquioxane as a filler. CONSTITUTION:A composition consisting essentially of 100pts.wt. polyorganosiloxane (A) of a viscosityat 25 deg.C of 50-500,000cP having at least two units of formula I [wherein R's are the same or different substituted or unsubstituted monovalent hydrocarbons, (a) is 1 or 2, (b) is 0-2 and (a)+(b)=1-3] in the molecule, 0.1-20pts.wt. alkoxysilane having units of formu la II [wherein R<2> and R<3> are the same or different substituted or unsubstituted monovalent hydrocarbons and (c) is 0-3], and having at least two Si-bonded OR groups in the molecule, or a condensate of its partial hydrolyzate, 0.01-5pts. wt. curing catalyst (C) and 0.5-300pts.wt. polymethyl-silsesquioxane (D) of an average particle diameter of 0.1-100mum.
申请公布号 JPS61159449(A) 申请公布日期 1986.07.19
申请号 JP19840280857 申请日期 1984.12.29
申请人 TOSHIBA SILICONE CO LTD 发明人 TAKEDA KIYOSHI;KIMURA HIROSHI
分类号 C08L83/00;C08K5/54;C08K5/5419;C08L83/04;C08L83/06 主分类号 C08L83/00
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