发明名称 SPUTTERING APPARATUS
摘要 PURPOSE:To prevent the rise of temp. in controller system to decrease mulfunction of IC, by providing fan units at upper, lower and center parts respectively, in a controller system of sputtering apparatus. CONSTITUTION:The controller system 12 contg. respective controller units is provided at the rear surface of a sputtering apparatus main body 11. The fan unit 13 having higher capacity than usual is provided at upper part of the system 12, and the fan unit 14 is provided at the position where filter is provided usually, at lower part. Further the fan unit 15 is provided also at upper part of vacuum system controller at center part. Since air supplying in to the system 12 and heat exhausting to outer part are carried out by the units 13, 14, 15 in such a way, operation rate can be improved.
申请公布号 JPS61157680(A) 申请公布日期 1986.07.17
申请号 JP19840276254 申请日期 1984.12.28
申请人 TOSHIBA CORP 发明人 HARADA MASATSUGU
分类号 C23C14/54;H01L21/203;H01L21/285;H01L21/31 主分类号 C23C14/54
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