| 摘要 |
PURPOSE:To improve productivity by providing a bending portion whose width is wider than a bore in a lead wire which is finer than a through hole of a cylindrical electronic parts, by coating liquid adhensive agent, and by heating after pressing it in the hole. CONSTITUTION:A bending portion 14 whose width d' is wider than a diameter D of a through hole 18 of beads 11 is formed extending over a length (b) of at most a length B of ferrite beads 11 in a center portion of a lead wire of diameter d. When a proper quantity of adhesive agent 16 is coated on the bending portion 14 and pressed in a hole 18, a part of the adhesive agent is sucked in a hole 12 together with the bending portion 14, and the rest is adhered to an outside of the hole 18. The ratio of a diameter D and d is chosen to be a value which makes a liquid adhesive agent generate capillary phenomenon by a space g. After the adhesive agent 16 is heated, coeffecient of viscosity is lowered, and after the adhesive agent 10 outside the hole 18 is accomodated in the through hole 12, it is heat-hardened. As the bending portion 14 is functioned by tacking and easily manufactured, an adhesive agent is filled in a short time and parts of good appearance is massproduced. |
