| 摘要 |
PURPOSE:To manufacture easily a coil having a thin line width and a large sectional area by constituting the titled method of a process for carbonizing the surface of a photoresist pattern of a positive type, a process for forming a groove on an insulating layer,a process for packing this groove with a vapor- deposited film, and a process for removing the photoresist pattern. CONSTITUTION:An exposure and a development processing which have used a mask having a prescribed coil pattern is performed to a photoresist layer 11 of a positive type, and a coil pattern 11a is formed. A thin carbonized layer 11ac is formed on the surface of the coil pattern which has been formed on an insulating layer 10. That of a state that the thin carbonized layer 11ac has been formed is used as a mask pattern, and by using a plasma of a tetrafluoride carbon gas, a dry etching treatment is executed to the insulating layer 10 by silicon dioxide,and a groove 10a of a depth corresponding to a thickness of a coil is formed on the insulating layer 10 by silicon dioxide. The groove 10a is packed with a conductive material 12 by vapor-deposition of the conductive material, and a mask pattern by a photoresist of a positive type is removed together with the conductive material 12 laminated on said pattern.
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