发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To strengthen the supporting force of a bed by a method wherein the extending direction of a tie bar is brought in the direction of the side face of a casing wherein an outer lead is extended, and the tie bar is formed short in length. CONSTITUTION:The tie bar 11, with which a bed 1 is supported in a hangdown state for a frame, is provided on the left and right side faces of the bed. To be more precise, the tie bar 11 is arranged between outer leads 5, and it is continuously provided on the bed 1 in such a manner that the end part 11a on the side of the bed does not come in contact with the inner lead 4. At this time, four tie bars are arranged, the tie bars 11 are continuously provided at the four corners of the bed 1, and the bed 1 is supported. According to this constitution, as the tie bar is short in length and there is a number of tie bars, the vibration and the inclination of the bed can be prevented effectively. Accordingly, the short-circuit generating between a chip and a lead 4 and the disconnection of wire can be prevented.
申请公布号 JPS61156756(A) 申请公布日期 1986.07.16
申请号 JP19840280343 申请日期 1984.12.27
申请人 TOSHIBA CORP 发明人 FUKATSU YASUSHI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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