| 摘要 |
PURPOSE:To enhance the reliability of sealing while using low-cost sealing glass by increasing the strength of the sealed part of the titled device by a method wherein a cap is coated with sealing glass in a double-step structure with a higher part inside. CONSTITUTION:A solder glass 26 applied to the cap 12 has a double-step structure of the lower part 26a outside and the higher part 26b inside. Since the solder glass is thicker inside when fused, the solder glass 26 flows out, inside the sealed part, as shown by (c) and spreads inside the sealed part to the inner walls of the ceramic substrate 11 and the cap 12 across their contact; then, the sealed part becomes thicker and increases its strength. This method can yield the ceramic package reliable almost equally to that by metal sealing while keeping low the production cost of the ceramic package. |
