发明名称 MODULE OF HYBRID IC
摘要 <p>PURPOSE:To increase heat-dissipating properties and strength, and to improve reliability by adopting a base plate with an element mounting region and a heat-dissipating region. CONSTITUTION:A base plate 20 consisting of ceramics is constituted by an element mounting region 21 and a heat-dissipating region 22 surrounding the region 21. The element mounting region 21 is formed by ceramics such as alumina having excellent heat-dissipating properties and printing properties. The heat-dissipating region 22 is shaped by ceramics having high mechanical strength against impact force, etc. such as zirconia having high purity. The strength of the heat-dissipating region 22 is set at a value of not less than twice as high as the elements 23 are fitted onto the element mounting region 21. A groove 24 is formed so as to surround the element mounting region 21 in the heat-dissipating region 22. A resin vesel 25, an upper section thereof is opened, is fitted to the groove 24. The resin vessel 25 is fixed by a resin 26 applied to a fitting section.</p>
申请公布号 JPS61154053(A) 申请公布日期 1986.07.12
申请号 JP19840273410 申请日期 1984.12.26
申请人 TOSHIBA CORP 发明人 MURASE NAOAKI;TAKAHASHI KENZO
分类号 H01L23/28;H01L23/373 主分类号 H01L23/28
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