发明名称 PHENOLIC RESIN COMPOSITION MODIFIED WITH BORIC ACID
摘要 PURPOSE:To produce the titled composition giving a molded article having improved heat-resistance without generating gas during molding, by using a resol-type phenolic resin wherein phenols and aldehydes are bonded with each other in a high-ortho form, and modifying the phenolic resin with boric acid, etc. CONSTITUTION:A phenolic compound is made to react with an aldehyde in the presence of a bivalent metal hydroxide (e.g. magnesium hydroxide) as a catalyst to obtain a resol-type phenolic resin wherein the molar ratio of the aldehyde bonded to phenol is 1.0-2.0, and the ratio of ortho-bond to para-bond is >=1.5. The objective composition can be produced by reacting the phenolic hydroxyl group of the phenolic resin with 0.15-0.5mol of boric acid or 0.075-0.25mol of boron oxide.
申请公布号 JPS61152717(A) 申请公布日期 1986.07.11
申请号 JP19840274104 申请日期 1984.12.27
申请人 SUMITOMO DEYUREZU KK 发明人 NOGUCHI KENICHI;HIRANO KAZUHISA
分类号 C08L61/00;C08G8/00;C08G8/28;C08K3/38;C08L61/04;C08L61/06 主分类号 C08L61/00
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