| 摘要 |
PURPOSE:To make the thickness of plating uniform among plural articles to be electroplated by supplying electric current to plural holding claws holding separately the articles from separate power sources. CONSTITUTION:copper plates 4a-4e for electric conduction are arranged on a holding bar 3 so that they are electrically insulated from each other, and the plates 4a-4e are electrically connected to wafer holding claws 2a, 2b, 2c..., respectively. The plates 4a-4e are also connected to electrodes 5a-5e. Wafers 1a-1e are separately suspended from the holding claws 2a, 2b, 2c... and electroplated. Since electric currents supplied to the wafers 1a-1e can be separately controlled, the thickness of plating is made uniform among the wafers 1a-1e.
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