| 摘要 |
PURPOSE:To obtain a semiconductor device with the inner leads not protruding from the outer periphery of the package by a method wherein the point parts of the inner leads are deformed in such a way as to crawl along the surface of the package in the interior of the package. CONSTITUTION:Inner leads 1 and 2 are bent upward in the interior of the package 3 and the point parts thereof 1a and 2a are deformed in such a way as to become the same plane as the surface of the package 3. The inner leads 1 and 2 and the tabs of an IC chip are wire-bonded. The IC does not have the leads to protrude from the surface of the package 3 and is leadless in appearance. As a result, a compartment mounting can be performed utilizing the point parts 1a and 2a. Moreover, the leads can be constituted in such a manner as shown by chain lines 1a' and 2a'. By making the IC into a leadless constitution, such troubles as break and bend of the leads are eliminated, thereby enabling to improve the reliability of the IC. |
