| 摘要 |
PURPOSE:An epoxy resin composition for pressure molding which can give a molding excellent in transparency, heat resistance, heat shock resistance, etc., obtained by mixing a specified mixed epoxy resin with an acid anhydride curing agent, an organic acid dihydrazide compound and a cure accelerator. CONSTITUTION:The titled composition is obtained by mixing 100pts.wt. mixed epoxy resin comprising 50-80pts.wt. bisphenol A-derived epoxy resin of a m.p. of 60-170 deg.C and 50-20pts.wt. triglycidyl isocyanate (derivative) with 30-150pts. wt. acid anhydride curing agent (e.g., phthalic anhydride), 0.1-20pts.wt. organic acid dihydrazide compound (e.g., isophthalohydrazide) and 0.1-10pts.wt. cure accelerator selected from among an imidazole compound, 1,8-diazabicyclo[5,4,0]- undecene-7 (salt) and an organophosphine compound (e.g., triphenylphosphine).
|
