| 摘要 |
PURPOSE:To provide the titled compsn. excellent in resistance to soldering heat, by incorporating a thermosetting resin, an additive, and a filler consisting mainly of molten silica powder and/or sintered aluminum silicate powder. CONSTITUTION:A thermosetting resin (e.g., solid resol-type phenolic resin), a filler contg. 50wt% or more, pref. 80wt% or more, molten silica powder and/or sintered aluminum silicate powder, 0.1-0.5wt%, based on the total compsn., silane coupling agent and/or titanium coupling agent and, if necessary, curing accelerators (e.g., arom. amines), antisagging agents (e.g., finely pulverized silica), thickeners (e.g., bentonite) and the like are incorporated to yield the titled compsn. The titled coating for dip coatings is yielded by incorporating a coating fluid with said compsn.
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