摘要 |
Low power circuitry components such as printed circuits with their associated resistors, transistors, chips and so on are formed from a plurality of laminae (100, 120, 150, 160) held together in a stack; in order to avoid crossing circuits, connections where cross overs are necessary, are made by providing one part (108) of a circuit on one lamina (100) connecting that to another part (139) on another lamina (120) by means of a perpendicular connection (109) and thence, for example, by a further perpendicular connection (142) to a connection 162 on a bottom lamina (160) to chip encapsulated between some of the laminae (120, 150, 160). The invention enables not only easier circuit design but also easier component assembly whereby chips and so on can be self locatable in the assembly. |