| 摘要 |
PURPOSE:To retain light sensitivity of 20-100 times that of conventional materials and to retain heat resistance at 400 deg.C or above after imidation by introducing a photosensitive group into the main chain, by reacting a tetracarboxylic acid dianhydride with a diamino compd. CONSTITUTION:A photosensitive polyimide precursor is represented by formula I (wherein R1 is a residue of a tetravalent arom. hydrocarbon; R2, R3 are each a residue of a bivalent arom. or aliph. hydrocarbon; R4-R7 are the same or different groups and each is H, halogen, alkyl; n>10) and can be obtd. by reacting a tetracarboxylic acid dianhydride of formula II (wherein R1 is as defined above) with a diamino compd. of formula III (wherein R2-R7 are as defined above). As the component of formula II, pyromellitic anhydride and 3,3',4,4'-benzophenonecarboxylic anhydride are preferred. As the component of formula III, 1,4-bis-[2-)3-aminobenzoyl)ethenyl] benzene is preferred.
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