| 摘要 |
PURPOSE:To prevent generation of bubbles in a resin or ejection of a resin by sealing the guide pin hole formed in a resin mold layer during a resin molding process with the viscous liquid heat-curable resin. CONSTITUTION:During a resin molding process, a mold die provided with a guide pin on a shaping plane is used in order to fix a lead frame at the predetermined level in a mold die cavity. As a result, a guide pin hole 3 is formed in the resin mold layer 1. A frame part 4 is exposed in the hole 3 and a mixture 5' of a curing agent and a viscous liquid heat-curable resin is dropped from an injector unit 7. Then it is cured under the predetermined conditions. Consequently the mixture 5' adheres to the mold layer 1 and is not ejected by the oscillation at introduction into an oven and the generation of bubbles can be restrained. |
