发明名称 |
End termination for chip capacitor. |
摘要 |
<p>A monolithic chip capacitor in which the electrode layers are bonded together at an edge. The capacitor includes an electrically conductive substrate that is electrically connected to the bonded edges of the electrode layers. The capacitor body has end terminal surfaces defined by electrically conductive material across one end of the body that is in electrically conducting contact with the substrate. In one form, the termination material is a folded end of the substrate itself. In another form, an end cap which can be thicker than the substrate, is folded to define the termination surface and to provide another surface in good electrical contact with the substrate.</p> |
申请公布号 |
EP0186765(A2) |
申请公布日期 |
1986.07.09 |
申请号 |
EP19850114470 |
申请日期 |
1985.11.14 |
申请人 |
SFE TECHNOLOGIES |
发明人 |
CICHANOWSKI, STANLEY WILLIAM;SHAW, DAVID GLENN;STRYCKER, DONALD SUMNER |
分类号 |
H01G4/232;H01G4/252;H01G4/08;H01G4/18;H01G4/228;H01G4/30;(IPC1-7):H01G1/147 |
主分类号 |
H01G4/232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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