| 摘要 |
PURPOSE:To obtain multichip modules of high reliability by a method wherein direct heat-dissipation from the circuit part is enabled by providing the top of a pellet crystal substrate with non-conduction metallic bumps directly connected in a thermal manner without interposing an insulation film. CONSTITUTION:In the cavity of a package, an Si mother chip 11 on which pellets 9 are bonded by face-down with solder bumps 10 is mounted on the device stage substrate 1 with solder 12, and this mother chip 11 is electrically connected to the inner ends of leads 4 with wires 13. The non-conduction bumps 10a purposing heat dissipation are directly connected in a thermal manner to both of the crystal substrate 9a of the pellet 9 and the main body substrate 11a of the mother chip 11. Providing the top of the pellet crystal substrate with non-conduction metallic bumps in the state of thermal direct connection enables direct heat-dissipation from the circuit part formed in the crystal substrate through the metallic bumps. |
