发明名称 IC MODULE BUILT-IN TYPE DATA MEMORY MEDIUM AND MANUFACTURE TEREOF
摘要 The integrated circuit embedded in a data carrier and the contact surfaces connected with this circuit are to be protected against bending of the data carrier. For this purpose, the data carrier is divided into two areas, the first one, which bears the circuit and is generally small compared to the second area, being connected to the second area via a predetermined breaking point. Stress which occurs when the data carrier is bent is kept away from the circuit, or transmitted only weakly to it, by the predetermined breaking point.
申请公布号 JPS60256887(A) 申请公布日期 1985.12.18
申请号 JP19850113320 申请日期 1985.05.28
申请人 GEE AA OO G FUYUURU AUTOMATSUIOON UNTO ORUGANIZATSUIOON MBH 发明人 YAHIA HAGIRIITERANI;YOAHIMU HOTSUPE
分类号 B42D15/00;B42D15/10;G06K19/06;G06K19/077 主分类号 B42D15/00
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