发明名称 |
Method of manufacturing printed boards |
摘要 |
At least one strip of dry film assembly is supplied continuously to a plurality of mutually spaced apart boards which are also being fed continuously. The film assembly consists of a photosensitive layer sandwiched between a protective film and a base. The base is removed from the assembly when the assembly is supplied to the boards, so that each of the boards may be bonded to the photosensitive layer. The boards and the film assembly are fed intermittently, and the photosensitive layer is exposed to light to print a predetermined pattern on each board. The protective film is removed from the film assembly, and each printed board is subjected to developing treatment.
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申请公布号 |
US4599297(A) |
申请公布日期 |
1986.07.08 |
申请号 |
US19820448245 |
申请日期 |
1982.12.09 |
申请人 |
ORC MANUFACTURING CO., LTD. |
发明人 |
YAZAKI, YOSHIO;OGAWA, SHINYA |
分类号 |
H05K3/06;G03F7/16;G03F7/30;H05K1/00;H05K3/00;(IPC1-7):G03C11/12 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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