| 摘要 |
<p>PURPOSE:To improve dissipating ability of the semiconductor device, by providing with a pellet mounting substrate having solid state adhesive with a predetermined thickness continuously coated around the pellet mounting section, the adhesive being thermoplastic or thermo-melting temporarily. CONSTITUTION:After a pellet 7 is mounted on a pellet mounting substrate and the pellet 7 and metalizing 2 are connected electrically with gold wires 8, silicone gel raw material 9 is filled. Next, with an aluminum cap 10 put on solid state adhesive 6, solely being heated to a given temperature under an applied pressure, a semiconductor device in which the back face of the cap 10 is being contacted sufficiently with the silicone gel 9a of heat conducting material can be easily manufactured, even if the silicone gel raw material 9 and the cap 10 are not contacted each other initially. In this way, since the cap and substrate can be bonded closely, by coating heat conducting material onto the pellet, etc., by putting the cap on the solid state adhesive, and by heating them to a predetermined temperature with pressure applied, after finishing the asembly, contact between the cap back face and heat conducting material can be easily attained.</p> |
